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Irradiation and Annealing Behaviour of Heavy Ion Implanted Silicon by TEM and the Channeling Backscattering Technique (Part B)

dc.contributor.advisorThompson, D. A.
dc.contributor.authorHaugen, Harold K.
dc.contributor.departmentEngineering Physicsen_US
dc.date.accessioned2015-11-04T16:04:15Z
dc.date.available2015-11-04T16:04:15Z
dc.date.issued1978-12
dc.descriptionOne of two project reports. Part A can be found at: http://hdl.handle.net/11375/18522en_US
dc.description.abstractRecent channeling-backscattering measurements of the disorder induced by heavy ion irradiation of semiconductors has indicated radiation damage far in excess of that predicted by linear transport theory. The present work extends the investigation to TEM and compares the two techniques in an annealing study of ion irradiated silicon (~ 80-200 a.m.u. ions of 15-100 keV) for low fluence (typically 3×10¹¹/cm² for TEM and 10¹²-10¹³/cm² for channeling) bombardment. In addition to showing a good correlation between the techniques, the results indicate that neither does there exist a unique relationship between lattice disordering and cascade energy density, nor that a well defined amorphous structure seems to exist.en_US
dc.description.degreeMaster of Engineering (ME)en_US
dc.description.degreetypeThesisen_US
dc.identifier.urihttp://hdl.handle.net/11375/18523
dc.language.isoenen_US
dc.subjectengineering physicsen_US
dc.subjectirradiationen_US
dc.subjectannealing behaviouren_US
dc.subjectheavy ion implanted siliconen_US
dc.subjectTEMen_US
dc.subjectchanneling backscattering techniqueen_US
dc.titleIrradiation and Annealing Behaviour of Heavy Ion Implanted Silicon by TEM and the Channeling Backscattering Technique (Part B)en_US

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