The Role of the Halides as Addition Agents During the Electrodeposition of Copper
| dc.contributor.advisor | Tomlinson, R. H. | |
| dc.contributor.author | MacArthur, Donald Morley | |
| dc.contributor.department | Chemistry | en_US |
| dc.date.accessioned | 2016-01-08T21:11:52Z | |
| dc.date.available | 2016-01-08T21:11:52Z | |
| dc.date.issued | 1966-05 | |
| dc.description.abstract | <p> The amount of chloride ion incorporated into a copper electrodeposit prepared from an aqueous copper sulphate solution has been determined at low chloride concentrations by the use of radiotracers. It has been found that the electrodeposits have a surface layer which is enriched in chloride ion. Evidence has been obtained that incorporation of chloride is preceded by the formation of cuprous chloride. The incorporation of chloride has been found to be increased by the presence of organic additives in the solution. The polarization during the first 30 seconds of electolysis has been interpreted using the knowledge obtained from the radiotracer work.</p> | en_US |
| dc.description.degree | Doctor of Philosophy (PhD) | en_US |
| dc.description.degreetype | Thesis | en_US |
| dc.identifier.uri | http://hdl.handle.net/11375/18718 | |
| dc.language.iso | en_US | en_US |
| dc.subject | halides, agents, electrodeposition, copper, chloride, ion | en_US |
| dc.title | The Role of the Halides as Addition Agents During the Electrodeposition of Copper | en_US |
| dc.type | Thesis | en_US |