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Structuring Silicones and Silica at Interfaces

dc.contributor.advisorBrook, Michael A.en_US
dc.contributor.authorRajendra, Vinodhen_US
dc.contributor.departmentChemistryen_US
dc.date.accessioned2014-06-18T21:13:42Z
dc.date.created2014-01-31en_US
dc.date.embargo2015-01-31
dc.date.embargoset2015-01-31en_US
dc.date.issued2014-04en_US
dc.description.abstract<p>The development of both silica and silicones has led to enormous improvements in available products over the last 50 years: the compounds have now found practical applications in fields ranging from electronics to biomaterials. Both of these materials have several desirable intrinsic properties. The compounds can be combined as a blend, in a composite or at an interface with other compounds to tune the chemical and physical properties to those desired. On their own, silica and silicones also have many applications. Their utility would be enhanced if it was possible to improve morphological control of the materials independently or together.</p> <p>This thesis explores various parameters and factors that enable the structuring of elastomers, colloids/suspensions, films and foams with the use of unconventional or new organosilicon chemistries. Specifically, amine and boron based catalysts are utilized to catalyze silicone and silica formation at different interfaces to create the materials mentioned above. Potential applications for these materials include drug delivery, GC chromatography and paper-based diagnostics.</p>en_US
dc.description.degreeDoctor of Philosophy (PhD)en_US
dc.identifier.otheropendissertations/8779en_US
dc.identifier.other9855en_US
dc.identifier.other5047289en_US
dc.identifier.urihttp://hdl.handle.net/11375/15336
dc.subjectsiloxanesen_US
dc.subjectelastomersen_US
dc.subjectcolloidsen_US
dc.subjectemulsionsen_US
dc.subjectfilmsen_US
dc.subjectresinsen_US
dc.subjectMaterials Chemistryen_US
dc.subjectOrganic Chemistryen_US
dc.subjectPolymer Chemistryen_US
dc.subjectMaterials Chemistryen_US
dc.titleStructuring Silicones and Silica at Interfacesen_US
dc.typethesisen_US

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