Welcome to the upgraded MacSphere! We're putting the finishing touches on it; if you notice anything amiss, email macsphere@mcmaster.ca

The Instantaneous Local Heat Flux in a Scraped-Surface Heat Exchanger

dc.contributor.advisorHoffman, T. W.
dc.contributor.authorYamanis, John
dc.contributor.departmentChemical Engineeringen_US
dc.date.accessioned2016-11-02T18:14:08Z
dc.date.available2016-11-02T18:14:08Z
dc.date.issued1970-10
dc.description.abstract<p> The objective of this investigation was to examine the potential of the point heat-flux meter in studying the dynamic heat transfer process in a scraped-surface heat exchanger.</p> <p> The heat-flux meters were an integral part of the copper heat exchanger which was steam-heated. Water was passed through the equipment as a thin film. The steam condensate was collected for measurement.</p> <p> Mathematical analysis related the transient differential temperature of the detector with the transient applied heat flux. A mathematical model was found that would estimate the instantaneous heat flux from the heat-flux-meter experimental temperature difference.</p> <p> Instantaneous and time-average local heat fluxes were measured by the heat-flux meter and the condensate respectively. The meter accuracy was -7000 Btu/hr sq ft.</p> <p> The heat-flux meter can be used in studying dynamic heat transfer processes.</p>en_US
dc.description.degreeMaster of Engineering (MEngr)en_US
dc.description.degreetypeThesisen_US
dc.identifier.urihttp://hdl.handle.net/11375/20760
dc.language.isoen_USen_US
dc.subjectinstantaneous, local heat flux, scarped-surface, heat exchanger, thin filmen_US
dc.titleThe Instantaneous Local Heat Flux in a Scraped-Surface Heat Exchangeren_US
dc.typeThesisen_US

Files

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
Yamanis_John_1970Oct_Masters..pdf
Size:
4.19 MB
Format:
Adobe Portable Document Format

License bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.68 KB
Format:
Item-specific license agreed upon to submission
Description: