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Please use this identifier to cite or link to this item: http://hdl.handle.net/11375/18718
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dc.contributor.advisorTomlinson, R. H.-
dc.contributor.authorMacArthur, Donald Morley-
dc.date.accessioned2016-01-08T21:11:52Z-
dc.date.available2016-01-08T21:11:52Z-
dc.date.issued1966-05-
dc.identifier.urihttp://hdl.handle.net/11375/18718-
dc.description.abstract<p> The amount of chloride ion incorporated into a copper electrodeposit prepared from an aqueous copper sulphate solution has been determined at low chloride concentrations by the use of radiotracers. It has been found that the electrodeposits have a surface layer which is enriched in chloride ion. Evidence has been obtained that incorporation of chloride is preceded by the formation of cuprous chloride. The incorporation of chloride has been found to be increased by the presence of organic additives in the solution. The polarization during the first 30 seconds of electolysis has been interpreted using the knowledge obtained from the radiotracer work.</p>en_US
dc.language.isoen_USen_US
dc.subjecthalides, agents, electrodeposition, copper, chloride, ionen_US
dc.titleThe Role of the Halides as Addition Agents During the Electrodeposition of Copperen_US
dc.typeThesisen_US
dc.contributor.departmentChemistryen_US
dc.description.degreetypeThesisen_US
dc.description.degreeDoctor of Philosophy (PhD)en_US
Appears in Collections:Open Access Dissertations and Theses

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